Shenzhen Developer Microelectronics CO., LTD was founded in April 2006, with a registered capital of RMB10 Million, and is located in High-Tech Park. The major businesses are IC design, packaging, test and sales. Till the end of  Last year our company achieved an annual turnover of over RMB5 billion.

Shenzhen Developer Microelectronics CO.,LTD has own packaging factory, located in Sichuan, named Sichuan Lippxin Microelectronics CO.,LTD. We finish packaging process at our own factory and Fujitsu as well. For our own package factory, we use the most advanced test equipment. Such as, ASM AD838 solid crystal machine, K&S bonding machine, Lang Cheng Die Mold and Cutting Molding system. The annual supply is up to 30 billion.